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Maximus VI Extreme Performance Tuning Guide

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power-tuning-2

Recommendations for Performance Tuning

 

For best overall DRAM Compatibility

• Install the memory in the Red slots first before occupying the grey ones.
• Install DRAM from the Red slot that is closer to the CPU first.

DIMM-slots

Remove USB devices

USB devices may decrease the system performance in some benchmarking programs. To improve performance, remove unnecessary USB hardware.

Optimal VGA Card Setup

For best performance with multiple VGA cards, please arrange them in the slot arrangement as indicated:

pci-express-m6e

For optimal PCI-Express performance, please install VGA cards onto PCIE_X16_1 (Red) and PCIE_X8_B2 (Grey) if only up to two VGA cards are to be used in the build.

For 2-way SLI or CrossFire-X install expansion cards onto PCIE_X16_1 or PCIE_X16_B2 to minimize chip to chip latency when attempting to achieve optimal performance.

As such, PCIEx16_1 will be limited to x8 mode when any PCIEx16 or PCIEx8 slot is being occupied as these lanes are directly linked to the CPU PCI-Express controller.

Remember to set the PCI Express Link Speed of all CPU native slots to GEN3 when GEN3 graphics or expansion card is in used. It should detect and default to it anyway, but you can force it.

pci-gen3

PCI-Express Power Management

Advanced\ Platform Misc Configuration\ PCI Express Native Power Management is recommended to be Disabled to prevent PCI Express devices from entering standby state to enhance both the device compatibility and performance as not all desktop based PCI Express devices support ASPM specification.

pcie-power-mgmt

Optimal CPU Core Use

Ai Tweaker\ASUS MultiCore Enhancement setting is recommended to be Enabled to allow the ASUS BIOS to rebalance performance per watt ratio. Since ROG is focused on performance it provides a better design and overall system performance than the Intel native settings.

power-tuning-2

DMI Standby States

Both ASPM control under Advanced\ PCH Configuration\ PCI Express Configuration are recommended to be Disabled to prevent the DMI Link between the CPU and the PCH chipset, as well as the devices installed on the PCH native PCI Express slots from entering standby state to enhance both the device compatibility and performance, as not all desktop based PCI Express devices support the ASPM specification.

pch-power

SATA Standby States

Advanced\SATA Configuration\Aggressive LPM Support is recommended to be Disabled to prevent SATA devices from entering standby state to enhance both the device compatibility and performance of SATA device, as not all SATA devices support SATA Aggressive LPM specification.

sata-power

For Optimal [SSD] Performance Readings

For more stable I/O readings, please ensure the Advanced\CPU Configuration\Dynamic Storage Accelerator option is Enabled in the BIOS. This activates the Intel Lake Tiny Technology, which avoids the I/O performance bottleneck due to Intel power saving functions.

power-tuning-1 

Maximus VI Power Saving & Power Tuning Guide

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cpu package state

Tuning for Optimal Power Consumption

Via UEFI BIOS Adjustments

Under Ai Tweaker

Disable the ASUS MultiCore Enhancement under BIOS to configure the system to power consumption biased state.  Enable the EPU Power Saving Mode under BIOS to activate the EPU function. multi-core

Under Extreme Engine DIGI+ III

Set the CPU Voltage Frequency option to Auto, and Active Frequency Mode to Enabled to allow the Extreme Engine DIGI+ III to manage the CPU Switching Frequency dynamically for optimal balance between the consumption and then delivery of power to the CPU integrated Voltage Regulator over time. Set the CPU Power Phase Control option and DRAM Power Phase Control to Optimized to best fit how Extreme Engine DIGI+ III should switch between multiple active power phases state with respect to the change of CPU and DRAM power consumption. phase control All other items under Extreme Engine DIGI+ III are advised to be left at default settings for optimal power consumption results.

Under CPU Power Management

CPU Integrated VR Efficiency Management can be configured Balanced to allow the CPU integrated voltage regulator to consume power more effectively to reduce CPU power consumption. Power Decay Mode can be configured to Enabled to allow the CPU integrated voltage regulator to enter lower power state mode to reduce CPU power consumption when the CPU idles down. Idle Power-In Response can be configured to Fast for the CPU integrated voltage regulator to have a quick entry to idle low power consumption state, to reduce power consumption. Idle Power-Out Response can be configured to Regular for the CPU integrated voltage regulator to have longer delay before exiting the idle low power state, to reduce power consumption.

power in out efficiency

The Fully Manual Mode option must be Disabled to allow the CPU integrated power saving schemes to take place. The CPU Core Voltage, CPU Cache Voltage, and CPU Graphics Voltage must be configured to anything but Manual Mode to allow any of the CPU integrated power saving schemes to take place.

fully manual

Advanced --> CPU Configuration

Set Boot Performance Mode to Max Battery to kick start the processor power saving functions prior entering the operating system to minimize the unnecessary consumption of CPU power.

boot performance

CPU Power Management Configuration

  • Set CPU C state to Enabled.
  • Set Enhance C1 State (previously known as C1E) to Enabled.
  • Set CPU C3 Report to Enabled to allow the CPU to enter C-State C3 State when the CPU idles down.
  • Set CPU C6 Report to Enabled to allow the CPU to enter C-State C6 State when the CPU idles down.
  • Set C6 Latency to Short to allow the CPU to respond to C-State C6 entrance request with a relatively shorter delay.
  • Set CPU C7 Report to Enabled to allow the CPU to enter C-State C7 State when the CPU idles down.
  • Set C7 Latency to Short to allow the CPU to respond to C-State C7 entrance request with a relatively shorter delay.
  • Set Package C-State Support to C7s to allow the system to send I/O devices to low power mode to reduce unnecessary power consumption when the system idles down.
Note that the CPU still enters the later C-States even if the earlier C-States are disabled. However the Package C State Support won’t function unless at least one of the CPU C-States has been enabled.
cpu package state

PCH Configuration --> PCI Express Configuration

Set DMI Link ASPM Control to Enabled, to allow DMI connection to the PCH chipset to enter low power state to reduce power consumption. However, this also introduces the trade-off of some performance considering latency exists to transition from lower to fully powered state.

dmi link

SATA Configuration

Aggressive LPM Support can be Enabled for devices on the SATA bus to be putted to a lower power state to reduce power consumption.  Note: Considering not all SATA devices support Aggressive LPM, please simply disable Aggressive LPM Support when encountering compatibility issues, due to the presence of non-LPM aware devices in the system.

aggressive LPM

System Agent Configuration --> NB PCIe Configuration

Set DMI Link ASPM Control to:
  • L0s: Device Standby State, some exit latency is introduced when returning from L0s.
  • L1: Lower Power Standby State, longer latency is introduced when returning from L1.
  • L0sL1: Activate both L0s and L1 support
Doing so allows the DMI connection inside the CPU to enter a lower power state to reduce power consumption. However, this also introduces the trade-off of some performance considering latency exists to transition from lower to fully powered state. Set PEG - ASPM to:
  • ASPM L0s: Device Standby State, some exit latency is introduced when returning from L0s.
  • ASPM L1: Lower Power Standby State, longer latency is introduced when returning from L1.
  • ASPM L0sL1: Activate both L0s and L1 support
Settings to any of the three models above to allow the devices connected to the CPU native PCI Express Bus to enter lower power states to reduce consumption of power. However, this also introduces some trade-off in some performance considering latency exists to transition from lower to fully powered state. Note: Considering not all PCIe devices support ASPM under the desktop platform, please try different modes or simply disable ASPM Support when encountering compatibility issues due to the presence of non-ASPM aware devices in the system. PCIE ASPM

Platform MISC Configuration

PCI Express Native Power Management can be Enabled to kick start the two types of ASPM functions configured earlier.  Note: Considering not all PCIe devices support ASPM under the desktop platform, please simply disable ASPM Support when encountering compatibility issues due to the presence of non-ASPM aware devices in the system.

pcie native power

APM

ErP Ready can be configured to:
  • Enabled (S4+S5) to cut the system standby power consumption under both the S4 Hibernate state and the S5 Soft Off state.
  • Enabled (S5) to cut the system standby power consumption under the S5 Soft Off state.
Setting to either of these options will be able to reduce then system to consume less than 0.5W under the desired ACPI state. However, all functions requiring standby power will also fail under this state. This includes any form of wake functionalities outside the power button, as well as USB BIOS Flashback and USB Charger+.

ErP

Please carry on to page 2 for software [OS] power management.

The ROG RAMDisk Software

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ramdisk-1

Those of you buying any of the Maximus VI motherboards or new RAIDR PCI-Express SSD, you will also have received the new ROG RAMDisk software bundled in your pack. I hope you didn't chuck that box and disc out just yet!

Since ROG is always in the pursuit of performance and its users often pack their systems with memory, the RAMDisk software makes perfect sense. A RAMDisk offers a magnitude of performance over traditional storage, as shown below.

 

ramdisk-1

You've overclocked to 4+GHz so why not make use of all that extra RAM to boost your storage performance as well? Game or application loading, virtual machines (although Intel K series don't support VT sorry) or other workstation-class software that demands ROG-level extreme compute power will all show a notable benefit.

Unlike many other RAMDisk software, the benefit of the ROG RAMDisk software is that it has no arbitrary limit; you can make dozens of small drives or just one huge one, for example, and it has certain functions to better preserve the life of your SSD. With NAND write life-cycles becoming ever smaller on each generation, it is key to preserving the long-term life of your SSD.

To learn more about the ROG RAMDisk, check out our innovation page which has more details.

Get Behind The Scenes With ASUS Design

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asus design

ASUS Design are the people who oversee the style and form of ROG products like the G series laptops, Tytan desktops, headsets, motherboard heatsinks and the ROG Armor, for example. It now has a portal detailing its work, so if you're interested in the design arm of ASUS, in terms of ROG and beyond (phones, AiOs, notebooks, projectors, tablets etc), then follow this link!

asus design

 

 

ASUS Unveils ROG Tytan G70 Gaming Desktop PC

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Tytan-G70-2

The 2013 Tytan based on the new Intel Core i7-4770K processor with on-the-fly, all-core overclocking, has arrived!

You'll remember the transforming chassis and internal watercooling from last year, but this year's upgrade gets a 4.1GHz CPU, up to 32GB of memory, a GeForce GTX 780 and SonicMaster audio.

Click the PR button below to read the full spec. 

[gallery size="medium" link="file" template="file-gallery"]

New ROG Official Wallpapers!

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ROG-Robot-3

These new official wallpapers feature the ROG Robot from this year's Computex! They are 1920 x 1200 in size.

Enjoy!

[gallery size="medium" link="file" template="file-gallery" columns="1"]

Boost My PC Arrives In Spain!


RAIDR Express Install Guide

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RAIDR Express

For RAIDR Express owners, we've constructed and FAQ and some tips about how to setup your system and use it in UEFI mode.

RAIDR Express FAQ

What is the difference between legacy mode and UEFI mode?

Under Legacy mode, the BIOS checks and verifies all the components and devices in turn during the system boot up, which produces a relatively lengthy boot time. However, on the other hand, the UEFI boot allows all devices to be initialized simultaneously, resulting in a relatively faster boot time. The RAIDR Express is the first PCIe SSD that supports both UEFI and Legacy Mode; this is called DuoMode.

Windows cannot boot correctly under UEFI mode.

This can be one of several things to check;

A. Activating UEFI mode requires installing the OS with this mode pre-enabled in its BIOS. Firstly, please make sure your motherboard can boot in UEFI mode [because not all UEFI-enabled motherboards support 'UEFI booting', due to a change in industry-wide firmware redesign for Windows 8]. Normally these are labelled as 'Windows 8 Ready'. If your motherboard does support it:

  1. If required, update the BIOS to the latest version,
  2. Backup your data,
  3. Delete the existing OS partition
  4. Enable boot from UEFI in the BIOS and on the RAIDR SSD.
  5. Re-install the OS.

B. Make sure Secure Boot is disabled within the BIOS.

C. If your BIOS does not support UEFI mode, only legacy mode is available to you. A future motherboard upgrade will allow you to perform the steps in part (1).

When should I switch between modes?

For modern motherboards UEFI BIOS booting should be present, however for older systems Legacy Mode is available to ensure compatibility.

Please note two important points about the DuoMode switch:

  1. Turn the PC power off before you switch between modes.
  2. We do not recommend users to flip that switch after the OS installation. We recommend you to reinstall OS after mode switching to prevent system instability or failed booting.

What BIOS settings should I change for UEFI Mode?

Firstly, please note that enabling the UEFI mode requires all system devices are required to have a UEFI firmware and driver: this includes things like graphics cards [integrated graphics are already supported from the motherboard UEFI BIOS].

If everything is a go on the BIOS/driver front, please refer to our installation guide for setting up a system in UEFI mode.

Why does the boot time get very long after installing RAIDR Express on my motherboard? or Why can’t I boot into my OS after installing RAIDR Express?

This may happen when you have more than one Marvell storage controller in the same system. The RAIDR Express is may experience a firmware conflict with Marvell storage controllers on the same system. It is therefore advised to disable other Marvell storage controllers in the motherboard BIOS.

Why isn’t my RAIDR Express Recognized in BIOS?

This may happen when your RAIDR Express is switched to UEFI mode, while the ‘CSM Support function’ is disabled in the BIOS, and there is no UEFI OS installed on it. Under UEFI Mode, only UEFI bootable devices will be listed as valid storage device. The RAIDR Express will show up as a “Windows Boot Manager” in the boot devices menu once the UEFI OS has been installed onto it.

SLI/CrossFireX won’t work with RAIDR Express installed?

Please note the PCIe lane distribution in your PC.

Intel CPUs in Maximus motherboards have 1x PCIe x16 lane from the CPU only, with a few extra PCIe 2.0 lanes from the PCH (southbridge), but these are often used by SATA controllers or GigE, for example. Nvidia SLI requires at least a PCIe x8 lane for each card to activate, while AMD CrossFire-X needs at least PCIe x4 lane for each card to activate. For example, Maximus V and VI boards with three PCIe 16x lanes and Ivy Bridge or Haswell CPUs can potentially split the lanes into 8x, 4x, 4x, so if you run SLI and drop a RAIDR Express into the third 16x slot it will disable SLI.

pcie-lane-split

RAIDR Express itself requires at least PCIe x2 to give sufficient bandwidth to the card, so PCIe 1x slots are insufficient.

The motherboard manual will explain how each PCIe slot is used, or, please ask on rog.asus.com/forums if you are still unsure.

I pressed “Ctrl+M” while booting, but I can't get to the configuration menu

There might be several reasons for this issue:

  1. First of all, RAID configurations can only be changed in Legacy Mode on the RAIDR Express. For users that plan to install the OS in UEFI boot mode, first set the RAIDR Express to legacy mode first, power up the PC and change the RAID configuration, then power off and switch to UEFI mode before installing the OS. Alternatively, use the MSU (Marvell Storage Utility) under Windows, however this cannot be done if the OS is running on the RAIDR Express.
  2. Please make sure the keyboard is connected directly to the PC and is correctly recognized early in the POST process. Some keyboards connected to USB hubs might suffer from delay and miss the opportunity.

 

ROG’s New UEFI BIOS Functions

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quick-note

Every generation ROG engineers add new functions into the UEFI BIOS. This generation those are the ROG Pulse, Last Modified Log, My Favorites, Quick Note and Secure Erase. This is in addition to the GPU.DIMM Post, F12 Screenshot, F3 Shortcut and CPU Level Up added previously. If you want to see more, check out our innovation pages below:

Motherboard Innovation Pages

ROG UEFI BIOS features

quick-note    

Maximus VI Impact Official Video

Video: ROG Mecha Fight!

Recommended Settings For Overclocking Maximus VI Motherboards

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overclocking-10

Recommended Settings For Overclocking

The following may help to achieve better overclocking results on the Maximus VI series overclocking and gaming motherboards.

Hardware Configurations for the ease of Overclock

DRAM

  • Install the memory in the Red slots first before occupying the Black ones.
  • Install DRAM from the Red slots that are closer to the CPU first.

DIMM-slotsiGPU

  • The integrated graphics inside the CPU silicon consumes power as well as generating heat. Logically then, you'll get a better overclock without using the internal graphics, instead using a PCI-Express graphics card. To shut-down the internal graphics, have iGPU Multi-Monitor Support set to Disabled in the BIOS to stop providing power to the iGPU when overclocking the CPU.

CPU Cooling

  • Use a qualified CPU cooler or a high-end CPU cooler, as the LGA1150 processor throttles down when CPU temperature exceeds its safety limit to reduce CPU temperature. It's strongly recommended to use either a CPU cooler that blows air downwards or that you have sufficient directional case airflow to the VRM heatsinks, so they are actively cooled when heavily overclocking.
  • For Haswell processors, due to the fact they are highly sensitive to the change in operational temperature, the OC margin may vary by a large degree between a selection of cooling solutions. From experimental results, aggressive cooling below zero should yield superb OC margins at reasonable voltages, however this obviously requires exotic cooling methods with environmental insulation to prevent condensation. (The CPU core temperature can be observed with Core Temp, for example: http://www.alcpu.com/CoreTemp/)

Software configurations to benefit overclocking

UEFI BIOS

overclocking-1

The Maximus VI Extreme features five sets of Overclocking Presets that enable an immediate access to a solid starting point for various O.C. combinations. Refer to appendix for the available presets.

  • Ai Overclock Tuner can be set to Manual to unlock BCLK/PCIE OC related options, set to X.M.P. to load the X.M.P. Profile from the DRAM module. X.M.P. can be used as a starting point to later modify the remaining options.
  • CPU Strap can be set to a different strapping to allow higher BCLK Frequency O.C. Users can try and raise or lower the CPU Strap if the desired BCLK cannot be achieved with your current CPU Strap. In addition, the relationship between the BCLK / PCIE / DMI Controller and the CPU Strap is that:

PEG Frequency = DMI Controller Frequency = 100 x (BCLK / CPU Strap)

Note: Usable CPU Strap varies with respect to the quality of the CPU.

If by any chance the change of CPU Strap is desired, one can leave the Source Clock Tuner at Auto for optimal O.C. capability utilizing higher CPU strap, or custom values. The Source Clock Tuner option will not be made available to adjustment unless the CPU Strap has been set to a fixed value.

  • PLL Selection can be set to Self Biased Mode (SB-PLL) to open wider frequency band for wider range of BCLK O.C. margin away from the configured CPU Strap, with the tradeoff of worse PCIE 3.0 compatibility due to the introduction of higher signal jitter at the PCIE. User can also leave at Inductance/Capacitance Mode (SB-LC) to minimize the introduction of jitter at the PCIE end for better PCIE 3.0 compatibility.
  • Filter PLL can be set to High BCLK Mode to slow down the filtering process in order to achieve a higher BCLK O.C. result with the trade off of more jitter. Generally speaking High BCLK Mode is only required when targeting for BCLK above 170MHz. User can happily leave it at Low BCLK Mode to allow better compatibility if otherwise.
  • ASUS MultiCore Enhancement can be Enabled to allow automatic configuration of the behavior of the Intel power saving and Turbo Boost for better overall performance when attempting to tweak the system in anyway outside the Intel default values.
  • Internal PLL Overvoltage can be set to Enabled to allow more CPU Turbo Ratio overclocking margin. However, please do keep in mind that the S3/S4 resume functionality on some DRAM modules may fail when enabling this function.
  • CPU bus speed: DRAM speed ratio mode can be altered between 100:100 and 100:133 when Ivy bridge processor is used. This will be very useful when trying to match the desired DRAM frequency, considering the DRAM frequency varies with respect to the change of DMI/PEG Frequency under 1:1 ratio, i.e. 1% raise in DMI/PEG Frequency will also bring 1% increase in DRAM Frequency.
  • Xtreme Tweaking can be enabled to yield better performance under older benchmarks applications.
  • CPU Graphics Max. Ratio is recommended to be left at the lowest 25 when targeting the highest CPU Frequency OC while the performance of the CPU integrated graphics is not the concern. This can help to reduce the power consumption and heat generated by the integrated graphics, yields more room for CPU core frequency tuning.

  • EPU Power Saving Mode is recommended to be left at Disabled before attempting to conduct manual O.C. to prevent degrading O.C. margin due to activities such as down voltage conducted by the EPU.
  • Fully Manual Mode is a special mode exclusively offered by Asus. Once enabled, will allow all six key voltages that are sent to the CPU to be set to a fixed value without the application of load-line (i.e. no voltage drop) rather than an offset from the voltage curve previously defined by Intel. Ideal for overclockers who are more used to traditional method of doing overvoltage. Note that under this mode, the CPU will no longer be able to lower any of the six key CPU voltages when the system idles down even if the CPU Power Saving Schemes such as EIST and the various C-States are enabled. Please disable this option if the use of the CPU built-in power saving schemes is desired.

  • The three most vital voltages going into the CPU, namely the CPU Core Voltage, CPU Graphics Voltage, CPU Cache Voltage, can be set to: Manual Mode to bring up the CPU Core Voltage Override, the CPU Graphics Voltage Override, and the CPU Cache Voltage Override option. Operating under this mode forces the CPU internal VR to feed a fixed value through the CPU Vcore, CPU Graphics, as well as the CPU Cache rail, each controls different part of the CPU. The manual mode will kick into effect as soon as the respective Voltage Override options are set to anything outside the default Auto. Under this mode, the CPU will no longer be able to lower its CPU Vcore voltage when the system idles down even if the CPU Power Saving Schemes such as EIST or the various C-States are enabled.

  • Offset Mode to bring up the Offset Mode Sign, as well as the CPU Core Voltage Offset, the CPU Graphics Voltage Offset, and the CPU Cache Voltage Offset option. Operating under this mode intakes the Intel defined SVID, summed with the three key Voltage Offsets, then outputted to the CPU Vcore, CPU Graphics as well as the CPU Cache rail each controls different part of the CPU. Leave the Voltage at Auto to load the Asus recommended offset value defined by the Asus OC Expert Team, or set to anything from +-0.001V and above to define the desired offset level. Setting to +-0.001V essentially makes the configured power rail to operate under factory default configuration.

  • Adaptive Mode, once configured will bring up the Offset Mode Sign, as well as the Voltage Offset and the Additional Turbo Mode Voltage for the CPU Vcore, CPU Graphics as well as the CPU Cache rail. The Adaptive Mode can be considered an extension of the Offset Mode. When working under this mode, the offset mode will be applied all the way up to the CPU Ratio before the CPU Ratio has been raised over the default Turbo Ratio. The configured Additional Turbo Voltage applies on the top of the result of the offset mode once the Turbo Boost enters O.C. state. Again, when either the offset of the additional turbo voltage are left at AUTO, the BIOS will load in the Asus recommended offset value defined by the Asus OC Expert Team. Setting to +-0.001V essentially makes the configured power rail to operate under factory default configuration.

  • SVID Support controls whether or not the CPU’s FIVR (Fully Integrated Voltage Regulator) should communicate with the external voltage regulator (Extreme Engine DIGI+ III) for the delivery of the CPU Input Voltage. Configuration this option to Enabled essentially establishes this communication while setting it to Disable forbids such communication, which yields better O.C. margin as compared with having it enabled. Considering this is outside the Intel CPU integrated Voltage Regulator, disabling SVID Support will “Not” affect the Intel integrated power saving functionalities such as EIST and the various C-States.
  • Dividing the “CPU Input Voltage” into “Initial CPU Input Voltage” and “Eventual CPU Input Voltage” enables users to apply different level of CPU Input Voltage before and after the POST sequence. This enables the weaker processors to utilize a higher voltage during the POST sequence to power up, then utilize a relatively lower voltage later to prevent overheat or overstressing the processor.
  • CPU Spread Spectrum options can be Disabled for better OC capability as Spread Spectrum attempts to generate minor fluctuation of the BCLK to prevent the emission of electrostatic interference from the CPU is not to exceed the health and safety regulation, which may in some ways affect the O.C. margin when every little change in BCLK needs to be take into consideration.
  • BCLK Recovery option can be Enabled to allow the system to boot under BIOS fail-safe mode while retaining the BCLK Frequency untouched.
  • CPU Load-Line Calibration can to be set to the highest Level 8 to ensure the CPU Input Voltage, i.e. the power going into the integrated voltage regulator is not to drop below the configured level for optimal OC results. This option can be lowered to reduce the amount of power consumption of the system when is under load.
  • CPU Voltage Frequency can to be set to Manual to allow selection of a fixed operating frequency for the Extreme Engine DIGI+ III. The higher the switching frequency, the faster the transient response, which yields a more stable delivery of CPU Input Voltage. This may help to yield just a little more BCLK O.C. margin for the CPU used. The effect of high CPU Voltage Frequency may vary with respect to the CPU used. It is highly recommended to Enable VRM Spread Spectrum or Enable Active Frequency Mode when not intending to set the CPU Fixed Frequency to the highest level to allow less emission of electromagnetic interference or better power saving.
  • VCCIN MOS Volt Control can be configured to a higher level for better O.C. stability with the tradeoff of a higher operation temperature, while configured to Active VGD enables the VCCIN MOS Volt Control option to be dynamically adjusted based on the load that the CPU FIVR drains from the Extreme Engine DIGI+ III.
  • CPU Power Phase Control can be set to Extreme to keep the number of active power phases of the CPU VRM at max for the whole time instead of powering down phases when CPU idles. This may gain a little more margin for stability when trying to achieve maximum core frequency. Alternatively, user can adopt Standard for down phase with respect to the change of the Intel PSI signal, optimized for better power saving, or define the custom down phase frequency manually. The faster the switch, the closer it is to setting CPU Power Phase Control to Extreme, just with the down phase capability.
  • CPU Power Duty Control can be set to Extreme to force the Extreme Engine DIGI+ III to function with respect to its maximum possible current delivery instead of a balanced temperature for a better delivery of power to the CPU integrated voltage regulator. This can also help to gain just a little more margin when trying to push CPU frequency to its max.
  • CPU Current Capability can be set to 140% to increase the CPU VRM over-current trip threshold. This allows the CPU integrated voltage regulator to drain more current from the Extreme Engine DIGI+ III, allowing the processor to achieve higher operating frequencies and increased software loads at those frequencies.
  • CPU Power Thermal Control can be set to a higher value when experiencing CPU throttling problems due to overheating Extreme Engine DIGI+ III. We recommended leaving this setting at default for all normal O.C., to ensure that the safe operating margins of the onboard CPU voltage supply are not breached. If experiencing throttling, the best advice is to cool the onboard Extreme Engine DIGI+ III with a fan to reduce temperature rather than altering this setting.
  • CPU Input Boot Voltage is the initial voltage that the Extreme Engine DIGI+ III delivers to the Intel FIVR (Fully Integrated Voltage Regulator) during the initial power sequence before the BIOS takes over.  This voltage is applied even before the Initial CPU Input Voltage option found under Extreme Tweaker is applied.  Careful adjustments of this voltage level may help to achieve a better O.C. result.
  • CPU Current Capability can be set to 130% to increase the DRAM VRM over-current trip threshold. This allows the CPU integrated voltage regulator to drain more current from the Extreme Engine DIGI+ III, allowing the DRAM to achieve higher operating frequencies and increased software loads at those frequencies.
  • DRAM Voltage Frequency can to be set to Manual to allow manual selection of a fixed VRM operating frequency. The higher the frequency, the faster the response, which yields a relatively stable delivery of VDIMM for the final push to gain just a little more DRAM overclocking capability for the DRAM used. The effect of high DRAM Voltage Frequency may vary with respect to the DRAM used.

  • DRAM Power Phase Control can be set to Extreme to keep the active power phase of the DRAM PWM at max for the whole time instead of shutting down a phase when DRAM idles. A setting of Extreme may gain a little more margin for DRAM overclocking when trying to achieve maximum DRAM frequency and or when populating all memory slots.
  • Long Duration Packet Power Limit defines the throttle point of when the CPU should throttle down when the power consumption exceed the defined level. This is also known as the first level of protection to prevent the CPU from been damaged due to overclocking. The unit is watte. The Intel default value of this option is the TDP(Thermal Design Power) of that processor. When left at AUTO, the BIOS will load the Asus recommended value defined by the Asus OC Expert Team for the ease of O.C.
  • Package Power Time Window defines the length of time in seconds that is allowed for the CPU to operate at above TDP yet below the Long Duration Package Power Limit. The unit is in seconds, with the maximum length limited at no more than 127.
  • Short Duration Package Power Limit defines the absolute highest power consumption that the CPU can sustain for a very short period of time to compensate the possibility of a sudden drain of power when under extreme high load. This is also considered the second layer of protection to prevent the CPU from been damaged due to overclocking. The unit is also in wattle. The Intel default of this value is 1.25 times the product defined TDP (i.e. the Long Duration Package Power Limit). Though Intel spec only requires the power plan to be capable of sustaining no less than 10ms when reaching the configured Short Duration Package Power Limit, the Asus motherboards can sustain much longer than that for the ease of O.C.
  • CPU Integrated VR Current Limit defines the highest current drain that is allowed by the CPU Integrated Voltage Regulator when under extreme high load. Raising this value to the maximum value of 1023.875 virtually means the disable of the current limit barrier on the Intel internal Voltage Regulator, which prevents the CPU from throttling down due to extensive current that is drained by the CPU when O.C.
  • Frequency Tuning Mode defines how quick the CPU integrated Voltage Regulator should operate. Rising to a higher value such as +6% enables smoother power delivery to the six key CPU voltages, while reducing this may help to reduce the overall power consumption of the CPU to some degrees.
  • Thermal Feedback defines whether or not the CPU should throttle down in respond to the overheat protection alarm triggered by the Extreme Engine DIGI+ III. This is the first layer of overheat protection of the Extreme Engine DIGI+ III and can be Disabled to allow more current drain from the Extreme Engine DIGI+ III till it reaches the absolute threshold temperature. It is highly recommended to keep the VRM heatsink fitted when disabling this option.
  • CPU Integrated VR Fault Management is recommended to be Disabled when attempting any level of overvoltage. This can help to yield a better O.C. capability involving the adjustment of any power options.
  • CPU Integrated VR Efficiency Management is recommended to be parked at High Performance to improve O.C. capability, whereas it can be left at Balanced to allow better power efficiency when the system is to be left at its default settings.

  • Power Decay Mode is the idle time power saving function of the CPU integrated voltage regulator. Can be set to Disabled to allow more O.C. margin while Enabled for better power efficiency, i.e. more power saving.

  • Idle Power-in Response controls how fast the integrated voltage regulator should respond to the reduction of power level requests when the CPU idles down. This option can be set to Regular for better O.C. margin just in case if the CPU load fluctuates too fast. Setting to Fast allows the CPU to drain relatively less power from the integrated voltage regulator over time, making it more power saving when in action.
  • Idle Power-out Response controls how fast the integrated voltage regulator should respond to the rise of power level request when load is applied to the CPU. Setting to Fast enables the CPU to receive the higher voltage with a relatively shorter delay, which essentially helps to improve the O.C. margin under extensive O.C.
  • Power Current Slope defines the steepness of the current slope for the integrated voltage regulator. Setting to a smaller value such as LEVEL-4 enables the CPU to be throttled at a later time while setting to a bigger value does the exact opposite.
  • Power Current Offset defines the offset from the current slope that is defined in Power Current Slope option. Setting to a smaller value such as -100% enables the CPU to be throttled at a later time while with the trade off of receiving incorrect TDP reading as the result.
  • Power Fast Ramp Response defines how much faster should the integrated voltage regular response to the immediate need of a higher voltage level requested by the CPU. The higher the input value, the faster it will act. Can configure this option to the maximum value of 1.5 for better O.C. margin.
  • Power Saving Level 1 Threshold defines the minimum level of current consumption where the CPU should throttle down to save power. Setting to 0 to disable this function, or a higher value to push the throttle effect earlier.
  • Power Saving Level 2 Threshold defines the minimum level of current consumption where the CPU should throttle down to save power. Setting to 0 to disable this function, or a higher value to push the throttle effect earlier.
  • Power Saving Level 3 Threshold defines the minimum level of current consumption where the CPU should throttle down to save power. Setting to 0 to disable this function, or a higher value to push the throttle effect earlier.

  • The VCCIN Shadow Voltage is the voltage level that the Extreme Engine DIGI+ III delivers to the Intel FIVR (Fully Integrated Voltage Regulator) in during the POST sequence.  This voltage level change happens between the Initial CPU Input Voltage and the Eventual CPU Input voltage. You can leave the VCCIN Shadow Voltage at Auto unless you want to get input voltage very high or very low throughout the boot process.
  • Termination Anti-Aliasing can be enabled to smooth out the change of the PLL Termination Voltage, which may sometimes help to yield a better O.C. result.
  • PLL Termination Voltage (Initial / Reset / Eventual)is a very useful rail residing in the PCH ICC Integrated Clock Controller. It is useful when pushing BCLK, or conducting extreme CPU O.C. with subzero cooling using substances such as LN2. The default value is 1.2V, recommended starting point for tweaking this voltage rail includes anything below 1.25V or above 1.6V. Avoid utilizing voltage level between 1.25V to the CPU Input Voltage to avoid touching the dead-zone that is not liked by the processor.
    • When pushing BCLK (in excess of 160+MHz), it is advised to configure the PLL Termination Reset Voltage and Eventual PLL Termination Voltage to the same or above the Eventual CPU Input Voltage. Therefore, for example if the Eventual CPU Input Voltage is to be configured to 1.90V, then the PLL Termination Reset Voltage and the Eventual PLL Termination Voltage should be configured to 1.90V or higher for optimal effect. The same relationship should be kept when overvoltage under the OS as well.  Therefore, please also remember to adjust the PLL Termination Voltage before changing the CPU Input Voltage to ensure optimal result.
    • When working with BCLK O.C. below 160MHz, sometimes it makes the overclocked CPU more stable when the PLL Termination Voltage has been reduced. Setting the PLL Termination Voltage to 1.10V or 1.00V may make the processor more stable under high clocks, or when subzero cooling is in used. To put in simple terms, keep this value under 1.25V, or keep it the same or above the CPU Input Voltage for optimal result.
  • X-Talk Cancellation Voltage may sometimes be raised to allow more stable O.C. when experiencing O.C. failures such as BSOD Error Code 0124.  However, the effect is the exact opposite when the Max. Vcore Voltage option has been enabled under LN2 mode.  Under such configuration, it may be wise to reduce this voltage rail to bring better stability.  The default value is 1.00V.
  • Cancellation Drive Strength manages the drive strength of the X-Talk Cancellation Voltage rail.
  • PCH ICC Voltageis the voltage rail of the Integrated Clock Controller.  With the default value of 1.200V, it has a different sweet spot that varies with the change of the DMI Frequency.
    • For High DMI Frequency (>=115MHz), try 1.2500V or lower.
    • For Low DMI Frequency (<=86MHz), try 1.7000V or higher.
  • ICC Ringback Cancellercan be used to control the noise level at the Integrated Clock Controller, where the effect varies with respect to its application:
    • Enable to allow better High DMI Frequency O.C.
    • Disable to allow better Low DMI Frequency O.C.
  • Clock Crossing VBoot: This is the initial boot voltage supplied at the very moment when a positive clock that is fed to the processor intersects with the negative clock. Usually lower is better for better O.C. margin, where the default value is 1.15000v. Lowering this voltage rail may help to yield a better DMI Frequency O.C. with the trade off of compensating the PCIE 3.0 compatibility, hence it is advised to try and raise this voltage rail when PCIE 3.0 compatibility issues occurred due to insufficient Clock Crossing VBoot. From experience, 0.8000V can be a good compromised value under most cases. Depending on the BCLK configured, increasing to 1.65v or decreasing this value may help improve the Cold Boot Bug under LN2 extreme OC condition.
  • Clock Crossing Reset Voltage: This is the system reset voltage supplied at the very moment when a positive clock that is fed to the processor intersects with the negative clock. Usually lower is better for better O.C. margin, where the default value is 1.15000v. Lowering this voltage rail may help to yield a better DMI Frequency O.C. with the trade off of compensating the PCIE 3.0 compatibility, hence it is advised to try and raise this voltage rail when PCIE 3.0 compatibility issues occurred due to insufficient Clock Crossing Reset Voltage. From experience, 0.8000V can be a good compromised value under most cases.

  • Clock Crossing Voltage: This is the stable voltage supplied at the very moment when a positive clock that is fed to the processor intersects with the negative clock. Usually lower is better for better O.C. margin, where the default value is 1.15000v. Lowering this voltage rail may help to yield a better DMI Frequency O.C. with the trade off of compensating the PCIE 3.0 compatibility, hence it is advised to try and raise this voltage rail when PCIE 3.0 compatibility issues occurred due to insufficient Clock Crossing Voltage. From experience, 0.8000V can be a good compromised value under most cases.
  • PECI Voltage generally speaking does not do much, however, it is still recommended to syncronice the PCEI Voltage with the PCH Voltage for optimal effect.
  • BCLK Amplitude controls the amplitude of the BCLK fed into the processor. From a nominal 0.7v Amplitude at 0, it can go up to 1.40v with the amplitude at +5. The value of +5 works great for most O.C. applications.
  • DMI GEN2 can be disabled when targeting BCLK above 200MHz. (i.e. DMI Frequency >= 120MHz) can help to trade the CPU to PCH link performance with more room for high BCLK O.C.
  • DMI De-emphasis Control can be manually adjusted to obtain better DMI Frequency tuning margin, though the default -6dB is the optimal configuration for most applications.
  • SATA Drive Strength can be tuned to allow better SATA compatibility. The default is 0, and can be adjusted to both sides.
  • CPU PCIE Controller can be used to disable the CPU integrated PCIEx16 lane to allow better 2D benchmark performance.  Once this option is disabled, the PCIE_x4_1 slot will be the only functional slot available for user expansion.
  • GEN3 Preset can be adjusted to allow different management for the device installed onto the PCIE 3.0 slots.  Though AUTO works well for most applications, users can also try to switch between various presets to see if that yields better performance.  This is especially useful when conducting multiple graphics card benching utilizing SLI or CrossfireX.
  • PLX 0.9V Core Voltage / PLX 1.8V AUX Voltage can be used to control the supply voltage towards the PLX PEX8747 PCIE 3.0 bridge controller.
  • PCIE Clock Amplitude is very similar to the BCLK Amplitude, apart from it is for the PCIE Frequency rather than the BCLK Frequency.  User can try and see the effect of tweaking this option when pushing high PCIE Frequency due to the raise of BCLK Frequency.
  • Internal Graphicscan be utilized to disable the CPU Integrated Graphics to spare more room for CPU O.C.
    • Onboard devices may affect the overall OC margin in some rare case, it is advised to disable all unused onboard devices when attempting to achieve the highest possible CPUOC.
  • It is recommended to keep other options at their default position “Auto” for better OC capability utilizing the OC experience of the Asus OC specialist team.

The G750JH Customized GTX 780M Graphics Card And Cooling

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G750-GTX780M-3

The G750JH is more than just a G750 with a new GTX 780M swapped inside; the ROG engineers had to make significant customizations in the chassis, cooling and even down to the core graphics PCB itself! Let's start with the the reason why most are interested in the G750JH: the new GTX 780M. [gallery include="25995,25994" size="medium" link="file" template="file-gallery" columns="2"] This is not a standard GTX 780M, the PCB is redesigned by ASUS engineers to be significantly bigger, which affords more components and more space between them too. Together this improves the provision of power, reduces EMI and the extra space aids cooling. In all, this GTX 780M is more tolerant and reliable. It's 3-phase power design (the entire PCB to the right of the memory chips) consists of 2-up, 2-down MOSFETs and upgraded, high-performance Tantalum capacitors. The 4GB of memory is supplied by 16 5GHz GDDR5 chips split between back and front sides, with the 1536-core'd GTX 780M in the middle. All that power needs to be cooled, and as you'd expect, this beast runs hotter than the lesser graphics cards, so needs extra cooling. Firstly let's look at the heat-plate that covers the entire PCB: GTX780M-heatsink-1 As you can see below, everything significant is cooled to ensure it runs smoothly. As with all G750 [and older G5s, and G4s etc] the graphics card is cooled separately to the CPU. With two heatpipes directly to the GPU core and another dedicated to the power hardware, no area is left out and it can quickly draw away heat to the fan. And yes, even the heatsinks are ROG branded! [gallery include="26000,26001" size="medium" link="file" template="file-gallery" columns="2"] At the other end of the heatpipe the fans and heatsinks are sufficiently upsized to cool it all. The example below is for CPU and GPU; the thicker fan and heatsink are the same for both, exhausting at either side of the rear of the G750. [gallery include="25997,26002" size="medium" link="file" template="file-gallery" columns="2"] The double-size heatsink is cut to match the chassis size exactly, which means the chassis enlargement has been minimized to keep its profile and weight as slim as possible.

The OC Main Event World Record Results

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OC-main-event-oc-records

The pro-overclockers at the OC Main Event in San Francisco have finished their overclocking efforts and have achieved five new world records! All were set using the Core i7-4960X, the Rampage IV Black Edition and Corsair Vengeance Extreme memory. The records list is as follows: 2D Benchmark 3D Benchmarks (4-ways SLI GTX Titan)
  • 8 Pack, Gunslinger, Rbuass and Shamino  - 3DMark 11 Entry – E382313DMark 11 Performance – P39231 and 3DMark Firestrike – 32268
[gallery include="26253,26230,26231,26232,26233,26234" size="medium" link="file" template="file-gallery" columns="2"]

Mixing Alu and Cooper Is Fine, If You Anodize Right

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crosschill-salt-spray-test-4

As ever, we're listening to you, our fans, and we've heard some (justified) concerns about the mixing of aluminum CrossChill hybrid heatsink/waterblock with all copper watercooling systems. Typically bare aluminum and copper mixed in an electrolytically active environment (like a watercooling system) will suffer corrosion through galvanic corrosion. However, anodizing the surface of the aluminum replaces the thin layer of aluminum oxide with a much harder and thicker layer. This provides sufficient environmental protection and resistance against galvanic corrosion. ROG's CrossChill anodizing is hard enough to resist galvanic corrosion. To prove the quality and lifetime reliability of the waterblock the ROG RD put the CrossChill through 216 hours of salt-spray testing to simulate three years of corrosive exposure. The results below speak for themselves: little to no effect! crosschill-salt-spray-test-1crosschill-salt-spray-test-2crosschill-salt-spray-test-3crosschill-salt-spray-test-4

GPU Tweak Streaming: Exclusive Beta for ROGers

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GPU-Tweak

ROG users are invited to join the new beta GPU Tweak Streaming software. The software is still in development so we'd enjoy hearing your feedback in the GPU Tweak forum. The software allows your friends and fans can watch you play by streaming your gameplay via popular services like Twitch.tv. The setup install process is simple: 1) Install Adobe Flash Media Encoder 2) Install GPU Tweak Streaming! Streaming Requires a minimum CPU of an Intel Core i5 or equivalent, which should be fine for our ROG crowd! However please note the minimum internet upload bandwidth to stream video: 
  • 4Mbps or higher for 720P
  • 6Mbps or higher for 1080P
  • 2Mbps or higher for 480P
  • 1Mbps or higher for 360P

New ROG Windows Themes

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rog-theme

By popular demand, we've got a few ROG themes for you to try on your PCs! (This update replaces the previous version). Rampage IV Black Edition Theme (Windows 8) ROG Robot Theme (Win 7) ROG Theme (Win 7) Addendum: The ROG forum thread on ROG themes has additional creations by community members. If you're after things like ROG branded replacement file folders, take a look at the great work being done there!

Installation

Installing is easy - simply click the setup file and the rest is done for you. (Before you start, save your current theme if you haven't done already!) ROG Theme Install This creates:
  • A new Windows theme (right click on the desktop --&gt; Personalize)
ROG Windows 7 Theme
  • Installs an ROG screensaver
ROG Screensaver
  • Updates your start button
ROG Start button
ROG Wallpapers
  • Updates your Computer icon on the desktop
ROG Computer Icon
  • And updates your mouse curser
ROG Mouse

Rampage IV Black Edition Official Video

New TechPowerUp ROG-themed GPU-Z 0.7.4 released

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TPU_GPUZ074ROG-1

TechPowerUp has released the latest version of its ROG-themed PC graphics subsystem information, monitoring, and diagnostics utility, the GPU-Z v0.7.4. The new version brings support for recently launched Radeon R9 series graphics cards as well as some upcoming Nvidia ones and also fixes some bugs found in the previous versions. As always, everything is done with a unique looking ROG theme. In addition to the added support for AMD R9 290X, R9 290 and the R9 270, the new GPU-Z v0.7.4 also brings support for HD 7310 and HD 8280 as well as support for the upcoming Nvidia GTX 780 Ti and GT 635 and Quadro K3100M graphics cards. The new GPU-Z also adds the release date for AMD Radeon R9 260X, R7 250 and R7 240 as well as fixes the release date for the AMD R9 280X. As far as the bug fixes go, the new GPU-Z v0.7.4 fixes the die size for AMD Tahiti, ROP count on Intel's Ivy Bridge and Haswell CPUs (APUs), fixes BIOS saving on AMD cards without driver, fixes some rare crashes on systems with Intel IGP, and adds an ability to pause the Render Test by simply left-clicking on the window. As always, the new version of the GPU-Z can be found over at Techpowerup.com.
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